 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| (R) STTH5R06D/FP/B/G TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM IRM (typ.) Tj (max) VF (max) trr (max) FEATURES AND BENEFITS s s K 5A 600 V 5A 175 C 1.8 V 40 ns K A A K TO-220FPAC STTH5R06FP TO-220AC STTH5R06D K K s s Ultrafast switching Low reverse recovery current Reduces switching losses Low thermal resistance A NC A NC 2 DESCRIPTION The STTH5R06D/FP/B/G, which is using ST Turbo 2 600V technology, is specially suited as boost diode in continuous mode power factor corrections and hard switching conditions. The device (available in TO-220AC, TO-220FPAC, D2PAK and DPAK) is also intended for use as a free wheeling diode in power supplies and other power switching applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) Parameter Repetitive peak reverse voltage RMS forward current DPAK STTH5R06B D PAK STTH5R06G Value 600 20 10 5 Unit V A A A TO-220AC / TO-220FPAC / D2PAK DPAK IF(AV) Average forward current TO-220AC Tc = 105C = 0.5 TO-220FPAC DPAK / D2PAK tp = 10 ms Sinusoidal IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature 50 - 65 + 175 175 A C C October 2002 - Ed: 3B 1/8 STTH5R06D/FP/B/G THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter TO-220AC / DPAK / D PAK TO-220FPAC STATIC ELECTRICAL CHARACTERISTICS Symbol IR Parameter Reverse leakage current Forward voltage drop Tests conditions VR = 600V Tj = 25C Tj = 125C IF = 5 A Tj = 25C Tj = 125C To evaluate the maximum conduction losses use the following equation : P = 1.16 x IF(AV) + 0.128 IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol trr Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A IF = 1 A dIF/dt = - 50 A/s VR = 30V IRM S factor Qrr tfr VFP IF = 5 A dIF/dt = 40 A/s VFR = 1.1 x VFmax Tj = 25C VR = 400 V IF = 5A dIF/dt = - 200A/s Tj = 125C 5.0 0.35 110 150 4.5 nC ns V Tj = 25C Min. Typ. Max. 25 40 6.0 A Unit ns 1.4 25 Min. Typ. Max. 20 250 2.9 1.8 V Unit A 2 Value 3.0 5.5 Unit C/W VF Fig. 1: Conduction losses versus average current. P(W) 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 T =1 = 0.05 = 0.1 = 0.2 = 0.5 Fig. 2: Forward voltage drop versus forward current. IFM(A) 50 45 40 35 30 25 20 15 10 5 Tj=25C (Maximum values) Tj=125C (Typical values) Tj=125C (Maximum values) IF(av)(A) =tp/T 6 tp VFM(V) 0 1 2 3 4 5 6 0 7 2/8 STTH5R06D/FP/B/G Fig. 3-1: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK, D2PAK). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse = 0.2 = 0.1 = 0.5 Fig. 3-2: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 = 0.5 T 0.3 0.2 = 0.2 = 0.1 T 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 =tp/T tp 0.1 Single pulse tp(s) 1.E-02 1.E-01 1.E+00 0.0 1.E-03 =tp/T 1.E+00 tp 1.E+01 Fig. 4: Peak reverse recovery current versus dIF/dt (90% confidence). IRM(A) 22 20 18 16 14 12 10 8 6 4 2 0 0 200 400 600 800 1000 IF=0.25 x IF(av) IF=0.5 x IF(av) VR=400V Tj=125C IF=2 x IF(av) Fig. 5: Reverse recovery time versus dIF/dt (90% confidence). trr(ns) 80 70 60 IF=2 x IF(av) VR=400V Tj=125C IF=IF(av) 50 40 30 20 10 IF=IF(av) IF=0.5 x IF(av) dIF/dt(A/s) dIF/dt(A/s) 0 0 200 400 600 800 1000 Fig. 6: Reverse recovery charges versus dIF/dt (90% confidence). Qrr(nC) 350 300 250 200 150 100 50 VR=400V Tj=125C IF=2 x IF(av) Fig. 7: Softness factor versus dIF/dt (typical values). S factor 0.70 0.65 0.60 0.55 IF=IF(av) VR=400V Tj=125C IF=IF(av) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 IF=0.5 x IF(av) dIF/dt(A/s) 0 0 200 400 600 800 1000 0.15 0.10 0 200 dIF/dt(A/s) 400 600 800 1000 3/8 STTH5R06D/FP/B/G Fig. 8: Relative variation of dynamic parameters versus junction temperature. Fig. 9: Transient peak forward voltage versus dIF/dt (90% confidence). VFP(V) 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 IRM S factor IF=IF(av) VR=400V Tj=125C 20 18 16 14 12 10 8 6 4 IF=IF(av) Tj=125C 0.25 0.00 25 Qrr Tj(C) 75 100 Reference: Tj=125C 2 125 dIF/dt(A/s) 0 100 200 300 400 500 50 0 Fig. 10: Forward recovery time versus dIF/dt (90% confidence). tfr(ns) 120 IF=IF(av) VFR=1.1 x VF max. Tj=125C Fig. 11: Junction capacitance versus reverse voltage applied (typical values). C(pF) 100 F=1MHz Vosc=30mV Tj=25C 100 80 60 40 20 dIF/dt(A/s) 0 0 100 200 300 400 500 VR(V) 10 1 10 100 1000 Fig. 12: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, Cu=35m) (DPAK and D2PAK). Rth(j-a)(C/W) 100 90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10 12 14 16 18 20 S(cm) 4/8 STTH5R06D/FP/B/G PACKAGE MECHANICAL DATA TO-220FPAC DIMENSIONS REF. A H B Millimeters Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Inches Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 Dia L6 L2 L3 L5 D F1 L4 L7 F G1 G E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. H2 C L5 OI L6 L2 D L7 A Millimeters Min. Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 14.00 2.95 15.75 6.60 3.93 3.85 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 13.00 2.65 15.25 6.20 3.50 3.75 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 0.511 0.104 0.600 0.244 0.137 0.147 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 0.551 0.116 0.620 0.259 0.154 0.151 5/8 A C D E F F1 G L9 F1 L4 H2 L2 L4 L5 E 16.40 typ. 0.645 typ. F G M L6 L7 L9 M Diam. I 2.6 typ. 0.102 typ. STTH5R06D/FP/B/G PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 Millimeters Min. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.60 0 Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 1.00 8 Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 0.023 0 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.039 8 0.80 typ. 0.031 typ. FOOT PRINT DIMENSIONS (in millimeters) DPAK 6.7 6.7 3 3 1.6 2.3 2.3 1.6 6/8 STTH5R06D/FP/B/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E L2 C2 Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 8 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 0 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 0 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 8 A A1 A2 D B B2 C L L3 A1 B2 B G A2 C R C2 D E G L L2 L3 M V2 * M R V2 0.40 typ. 0.016 typ. * FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 7/8 STTH5R06D/FP/B/G Ordering code STTH5R06D STTH5R06FP STTH5R06B STTH5R06B-TR STTH5R06G STTH5R06G-TR s s s s Marking STTH5R06D STTH5R06FP STTH5R06B STTH5R06B STTH5R06G STTH5R06G Package TO-220AC TO-220FPAC DPAK DPAK D2PAK D PAK 2 Weight 1.9 g 1.7 g 0.3 g 0.3 g 1.48 g 1.48 g Base qty 50 50 75 2500 50 1000 Delivery mode Tube Tube Tube Tape & reel Tube Tape & reel Cooling method: by conduction (C) Recommended torque value (TO-220AC): 0.55 Nm Maximum torque value (TO-220AC / TO-220FPAC): 0.7 Nm Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 8/8 |
Price & Availability of STTH5R06G-TR
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |